The custom XRING 01 was previously unveiled by Xiaomi CEO Lei Jun, but the executive did not provide a launch date on that occasion. Thankfully, it did not take a lot of waiting around because the latest teaser poster provides details on that front and mentions some key specifications that we are confident the majority of readers have been wanting to know for quite a while. Regarding lithography, the XRING 01 is said to be mass produced on the second-generation 3nm process, likely belonging to TSMC, meaning that the in-house chipset is now in the same ranks as A19, A19 Pro, Snapdragon 8 Elite, Dimensity 9400, and Dimensity 9400+.
The latest teaser poster mentions a May 22 launch date for the Xiaomi XRING 01, burying rumors about being fabricated on an older manufacturing process
The two launch posters below highlight that Xiaomi does not only intend to unveil the XRING 01, but there could be other products in tow that could be powered by the company’s next-generation in-house silicon. Interestingly, one of the teasers confirms the manufacturing process of the chipset, and where a previous rumor claimed that TSMC’s 4nm node will be leveraged, Xiaomi most probably had the competition surprised by utilizing the second-generation 3nm process.
However, unlike the Snapdragon 8 Elite, the XRING 01 will not feature any in-house cores, with a previous benchmark leak revealing the SoC to obtain an impressive single-core and multi-core result through its 10-core cluster that comprises of ARM’s current-generation CPU designs. We are not sure how the U.S. government will respond to this imminent announcement, but we previously discussed that one of the reasons why Xiaomi could be rumored to use the 4nm process instead of the 3nm one was perhaps to avoid any unwanted attention from the Trump administration.
This teaser certainly means that Xiaomi is not concerned about any repercussions and wants to compete with the top players in the industry with its XRING 01. The upcoming chipset is also a positive sign that the Chinese firm aims to reduce dependency on Qualcomm and MediaTek. With rising silicon costs due to gravitating to advanced lithography, it will eventually become unsustainable for Xiaomi to continue selling its flagship smartphones at an acceptable price, so the only way to maintain competitiveness is to jumpstart its chipmaking ambitions.
